Please use the program details included in the Abstract book.

Confirmed Keynote Speakers

Prof. Peter Herman, University of Toronto, Canada
Femtosecond laser processing in photonics ‐scribing, welding and 3D nano-structuring

Prof. Seung-Boo Jung, Sungkyunkwan University, Korea
Bonding process of electronic package using IPL energy and Its Reliability of BGA Component

Dr. James Pomeroy, University of Bristol, United Kingdom
Heterogenous Integration ‐ Thermal and Mechanical Challenges

Prof. Oliver G. Schmidt, Technische Universität Chemnitz, Germany
4D materials for electronic skin and microrobotic systems

Prof. Yoshikazu Takahashi, Tohoku University, Japan
Latest integrated power module and unit technology using WBG devices

Confirmed Invited Speakers

Prof. Michel Calame, EMPA, Switzerland
Integrating Low Dimensional Materials for Quantum Technology and Sensing

Prof. Hongjun Ji, Harbin Institute of Technology (Shenzhen), China
Cu@Ag nanoparticles: synthesis, characterization, sintering mechanism and applications
for power and flexible printed electronics

Prof. Yvonne Joseph, TU Bergakademie Freiberg, Germany
New Materials for Joining Microelectronic Components

Prof. Lei Liu, Tsinghua University, China
Sintering behavior of nano porous film for device integration including power electronics, chiplet and flexible electronics

Prof. Yongfeng Lu, University of Nebraska-Lincoln, USA
Joining Diamond with Copper in Additive Manufacturing

Prof. Peng Peng, University of Waterloo, Canada
Direct laser writing of composite structures: process and application

Prof. Chenxi Wang, Harbin Institute of Technology, China
Heterogeneous Direct Bonding: From Microelectronics to Biomedical Implantation

Prof. Bernhard Wunderle, Technische Universität Chemnitz, Germany
Thermo-mechanical characterization and reliability of advanced system integration technologies

Prof. Tetsu Yonezawa, Hokkaido University, Japan
High-strength bonding with low-temperature sintering copper nanoparticles