Please use the program details included in the Abstract book.
Prof. Peter Herman, University of Toronto, Canada
Femtosecond laser processing in photonics ‐scribing, welding and 3D nano-structuring
Prof. Seung-Boo Jung, Sungkyunkwan University, Korea
Bonding process of electronic package using IPL energy and Its Reliability of BGA Component
Dr. James Pomeroy, University of Bristol, United Kingdom
Heterogenous Integration ‐ Thermal and Mechanical Challenges
Prof. Oliver G. Schmidt, Technische Universität Chemnitz, Germany
4D materials for electronic skin and microrobotic systems
Prof. Yoshikazu Takahashi, Tohoku University, Japan
Latest integrated power module and unit technology using WBG devices
Prof. Michel Calame, EMPA, Switzerland
Integrating Low Dimensional Materials for Quantum Technology and Sensing
Prof. Hongjun Ji, Harbin Institute of Technology (Shenzhen), China
Cu@Ag nanoparticles: synthesis, characterization, sintering mechanism and applications
for power and flexible printed electronics
Prof. Yvonne Joseph, TU Bergakademie Freiberg, Germany
New Materials for Joining Microelectronic Components
Prof. Lei Liu, Tsinghua University, China
Sintering behavior of nano porous film for device integration including power electronics, chiplet and flexible electronics
Prof. Yongfeng Lu, University of Nebraska-Lincoln, USA
Joining Diamond with Copper in Additive Manufacturing
Prof. Peng Peng, University of Waterloo, Canada
Direct laser writing of composite structures: process and application
Prof. Chenxi Wang, Harbin Institute of Technology, China
Heterogeneous Direct Bonding: From Microelectronics to Biomedical Implantation
Prof. Bernhard Wunderle, Technische Universität Chemnitz, Germany
Thermo-mechanical characterization and reliability of advanced system integration technologies
Prof. Tetsu Yonezawa, Hokkaido University, Japan
High-strength bonding with low-temperature sintering copper nanoparticles
5th International Conference on Nanojoining and Microjoining
Organized by Technische Universität Chemnitz - Group of Composites and Material Compounds